PRODUCTS
Glossary
A B C D E F G H I J K L M
N O P Q R S T U V W X Y Z
M
MAGICS
Mask Blanks
Mask Substrate
MDP
MEMS
ML2
Molding
Mounting
μm
MAGICS
Multiple image Acquisition for Giga-bit pattern Inspection with Confocal System
Generic term for Lasertec Blanks Inspection system for wafer or mask
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Mask Blanks
Substrates that are used for making Photomasks.
Glass substrates with light shielding layer and resist layer coated that is used for Photomask manufacturing.
Patterning is yet to be performed on this substrate.
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Mask Substrate
Glass substrates that are used in manufacturing Mask Blanks.
Typical mask substrates have the size of 152mm square with 6.3mm thickness, and are made with quartz.
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MDP
Mask Data Preparation
Since recent photomasks require complicated OPC, MDP cost is increasing.
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MEMS
Micro Electro Mechanical Systems
Three dimensional micro electronic and mechanical system (micro system, micro machine)
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ML2
Maskless Lithography
A kind of lithographic technology which does not require photomask.
It is mainly referred to a multi e-beam direct writing technologhy aiming to improve throughput.
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Molding
Inclusion of chips by mold packaging works to protect chips from dust, humidity and such. Resin is usually used as molding materials.
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Mounting
Mounting is to mount a chip on substrate.
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μm
Micron meter
Unit of length
One thousandth of 1 millimeter
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