Mask related
Middle/Large Photomask Inspection Systems
LI34/LI44
| High quality and high sensitivity inspection respond to the diversification andfiner patterns of the Middle/Large Photomasks |
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Applications
- Inspection of photomasks for LCD's
- Inspection of photomasks for printed circuit boards
- Inspection of bump masks
Features
- Digitization of the inspection circuits such as ALL DET, EDGE DET and CELL SHIFT has made it possible for all these inspection circuits (modes) to be compatible with various patterns on masks.
- In addition to the standard inspection format MEBES, the system is compatible with various CAD formats such as DXF, Gerber and GDS by option.
- Die to Die and Die to Database are equipped as standard modes.
- Compatible with various mask sizes;
LI44 300mm×300mm～1200mm×1100mm, LI34 300mm×300mm～900mm×900mm - Reduced foreign particle adherence to masks by holding a mask vertically under air down flow from the top of the system.
- Selective setting of two lenses out of the three standard lenses that are 5X, 10X and 20X optimizes the system sensitivity and inspection throughput.
- Realized user-friendly operability
- A clean unit (FFU) as a standard equipment
- Small footprint realized by design pursuing compactness
LI44 W:3410 mm / D:1050 mm LI34 W:2680 mm / D:1015 mm
Specifications
| Inspection surface | Patterned surface of Photomask |
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| Inspection Sensitivity | 0.75μm(Objective lens:20X, Speed:Slow) |
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| Mask sizes | LI44 300mm×300mm～1200mm×1100mm
LI34 300mm×300mm～900mm×900mm |
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