Wafer Inspection / Review System

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• Evaluation and improvement of wafer manufacturing processes
• Outgoing and incoming inspections of wafers
• Development of materials for polishing and cleaning

• Further improved sensitivity for killer defects such as PID, Shallow scratch, COP, SF and so on that are generated in wafer manufacturing processes.
• Quick defect class verification by high-speed and high-resolution review function based on confocal optics supports speedy improvement of wafer quality.
• High precision defect coordinate verification and dust-free defect position marking with a diamond chip make the process monitoring, such as analysis of root cause for defect generation, easy. Verified defect coordinates greatly contribute to further analyses by SEM, TEM, AFM and so on.
• Besides mirror polish wafer, wafers covered by layers such as epitaxial wafers and SOI wafers that are vulnerable to haze, can be inspected with high sensitivity.
• Quartz wafer, difficult to be inspected by the light scattering method due to the effect of scattered light from wafer back surface and wafer chucking mechanism, can be inspected by similar sensitivity as that for wafers covered by layers.
• Introduction of newly developed 63 beam optics and stage of light weight with low gravity point implements throughput twice as high.Power saving function and longer lifetime of the laser light source reduces CoO by 40%.
• Wafer handling can be selected from two kinds of specifications.
  - Outgoing and incoming inspection: Edge-grip and back surface non-contact chuck
  - Evaluation and analysis: Vacuum suction chuck for multi-sizes (6, 8 and 12 inches)
• Compatible with FOUP and FOSB open cassettes