Mask related
Photomask Inspection System
MATRICS X600Series
| Photomask inspection system for semiconductor devices of 65nm node and further |
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Applications
- Outgoing inspection before Photomask shipment
- Incoming inspection, regular inspection and haze inspection of Photomasks at Wafer fabs
Features
- Compatible with the most advanced phase shift masks such as EPSM and APSM
- Compatible with OPC (Optical Proximity Correction) masks such as Assist Bar, Serif, Hammer Head
- Usage of a Hg/Xe lamp that possesses an emission line at 248nm makes running cost cheaper than laser light source requires, and enables simpler and easier maintenance.
- Compatible with automatic transportation of masks with OHT and such (Option)
- Possible to inspect photomasks after pellicle has been mounted.
- Design pursuing compactness by installing power sources and controlling systems within the main body (W:1555mm x D:2555mm)
Specifications
| Inspection modes | Multi die mode (including Array mode), Single die mode and combined inspection of these modes |
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| Inspection light | Three modes (Transmission, Reflection and simultaneous illumination of Transmission/Reflection) |
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| Detection sensitivity | Maximum sensitivity 30nm
*Detection sensitivity differs depending on defect types and inspection methods. |
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| Inspection time | 105 minutes/100mm (Normal Scan)
60 minutes/100mm (Fast Scan) |
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| Mask size | 6025 |
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