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Mask related
Photomask Inspection System
MATRICS X700 Series
| Photomask inspection system for semiconductor devices of 45nm node and further |
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Topics
Applications
- Incoming and regular inspection / haze inspection at Wafer fabs
- Outgoing test at Photomask production facilities (Possible to inspect after pellicle mounting)
Features
- Best suited for inspection and quality management of the most advanced Photomask of the hp45 nm node and further
- Compatible with phase shift masks (EPSM, APSM) and OPC (Optical Proximity Correction)
- Accomplished high-sensitivity detection by using an original all solid-state laser of 213 nm as a light source.
- Flexible mechanical interface with OHT automatic transportation and such is also available.(Option)
Specifications
| Inspection modes | Multi die mode (including Array mode), Single die mode and combined inspection of these modes |
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| Inspection light | Three modes (Transmission, Reflection and simultaneous illumination of Transmission/Reflection) |
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| Detection sensitivity | Maximum sensitivity 25nm
*Detection sensitivity differs depending on defect types and inspection methods. |
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| Inspection time | 105 minutes/100mm
(Normal Scan)
60 minutes/100mm
(Fast Scan) |
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| Mask size | 6025 |
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