Wafer related
MURA/CD Error High Resolution Visualizing System
WASAVI Series MR300
| High resolution visualizing system catches thickness variation/CD error in a very small area over the whole wafer surface |
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Application
- Inspection of thickness unevenness in the resist application process
- Inspection of CD errors and pattern shape deformation after exposure/development
- MURA/scratch inspection in the etching, CMP and layer formation processes
Features
- Detection of minute defective area by high-resolution visualization over the whole wafer area
- Detection of fine thickness unevenness with high sensitivity
- Detection of CD errors in the several-tens-nanometer range
- Acquisition of surface layer information regardless of any effect from substrate
- Fulfilling and easy-to-use display function, and sophisticated analysis function
Specifications
| Tool Dimensions | 1580(W)x 2870(D)x 2530(H) |
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| Applicable substrate size | φ 200 and 300 mm Wafers |
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| Throughput | 100 WPH or above(Under the standard Mode) |
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