Top Page > Products > Semiconductor Inspection Systems> Mask related > Pellicle/Photomask Particle Inspection System PEGSIS P100
PRODUCTS
Semiconductor Inspection Systems

Mask related

Pellicle/Photomask Particle Inspection System

PEGSIS P100
A high speed and high sensitivity particle inspection system compatible with photomasks for semiconductor devices with 90nm node and further Pellicle/Photomask Particle Inspection System PEGSIS P100
Catalog
Mail

Applications

  • Outgoing inspection after pellicle placing in the photomask manufacturing process
  • Incoming inspection and regular inspection on photomask at wafer fabs
  • Photomask quality confirmation inspection right before photomask usage at wafer fabs

Features

  • A Particle Inspection System with achievement of highest inspection speed and highest sensitivity in the industry, which is compatible with photomasks for semiconductor devices with 90nm design rule and further.
  • A Particle Inspection System best suited for outgoing test of photomasks, incoming test of photomasks at wafer fabs and quality assurance of Photomasks right before usage, with its highest performance and functions.
  • Because the detected particles can be observed under bright view or dark view and image data of particles can be stored, the system is effective not only for confirming whether is good or bad but also for quality management and analysis.
  • Because the size of particles can be accurately measured by a CCD camera, very reliable determination of the photomask whether is good or bad is possible
  • All automatic inspection, automatic defect review and automatic defect size measurement functions are available as standard functions and high operability is realized.
  • A clean unit (FFU) is available as a standard equipment.
  • An autoloader for Reticle SMIF Pod (RSP) is available as standard equipment. Also, the system has flexibility as being compatible with stepper case and such. (Option)
  • Inspection function for mask sucking areas of exposure system (Option)
  • A function to remove particles can be installed (Option) and particle adhered to pellicle surface or glass surface can be easily removed. Because particles that have possibility to transfer image can be removed without pulling out photomask from the inspection system, the productivity slowdown caused by re-placing or re-cleaning of pellicles is prevented.

Specifications

Mask size6025
Inspection timeLess than 1 minute / one surface
Particle inspection sensitivity4μm
ThroughputLess than 10 minutes (2 surface inspection including Photomask conveying time)
Light SourceLaser (Wavelength 532 nm)
Catalog
mail
PAGE TOP