Mask related
Pellicle/Photomask Particle Inspection System
PEGSIS P100
| A high speed and high sensitivity particle inspection system compatible with photomasks for semiconductor devices with 90nm node and further |
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Applications
- Outgoing inspection after pellicle placing in the photomask manufacturing process
- Incoming inspection and regular inspection on photomask at wafer fabs
- Photomask quality confirmation inspection right before photomask usage at wafer fabs
Features
- A Particle Inspection System with achievement of highest inspection speed and highest sensitivity in the industry, which is compatible with photomasks for semiconductor devices with 90nm design rule and further.
- A Particle Inspection System best suited for outgoing test of photomasks, incoming test of photomasks at wafer fabs and quality assurance of Photomasks right before usage, with its highest performance and functions.
- Because the detected particles can be observed under bright view or dark view and image data of particles can be stored, the system is effective not only for confirming whether is good or bad but also for quality management and analysis.
- Because the size of particles can be accurately measured by a CCD camera, very reliable determination of the photomask whether is good or bad is possible
- All automatic inspection, automatic defect review and automatic defect size measurement functions are available as standard functions and high operability is realized.
- A clean unit (FFU) is available as a standard equipment.
- An autoloader for Reticle SMIF Pod (RSP) is available as standard equipment. Also, the system has flexibility as being compatible with stepper case and such. (Option)
- Inspection function for mask sucking areas of exposure system (Option)
- A function to remove particles can be installed (Option) and particle adhered to pellicle surface or glass surface can be easily removed. Because particles that have possibility to transfer image can be removed without pulling out photomask from the inspection system, the productivity slowdown caused by re-placing or re-cleaning of pellicles is prevented.
Specifications
| Mask size | 6025 |
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| Inspection time | Less than 1 minute / one surface |
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| Particle inspection sensitivity | 4μm |
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| Throughput | Less than 10 minutes (2 surface inspection including Photomask conveying time) |
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| Light Source | Laser (Wavelength 532 nm) |