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Photomask Inspection SystemMATRICS X700 Series
Photomask inspection system for semiconductor devices at 45nm node and beyond
- Basic Information
Features
- Best suited for inspection and quality management of the most advanced Photomask of the hp45 nm node and further
- Compatible with phase shift masks (EPSM, APSM) and OPC (Optical Proximity Correction)
- Accomplished high-sensitivity detection by using an original all solid-state laser of 213 nm as a light source.
- Flexible mechanical interface with OHT automatic transportation and such is also available.(Option)
Lasertec Corporation was awarded an industrial prize ("Prize for Encouragement") by the Laser Society of Japan for its significant contribution to the progress of the laser and optics-related industry achieved by the MATRICS X700-series photomask inspection system.
Applications
- Incoming and regular inspection / haze inspection at Wafer fabs
- Outgoing test at Photomask production facilities (Possible to inspect after pellicle mounting)
Specifications
| Inspection modes | Multi die mode (including Array mode), Single die mode and combined inspection of these modes |
|---|---|
| Inspection light | Three modes (Transmission, Reflection and simultaneous illumination of Transmission/Reflection) |
| Detection sensitivity | Maximum sensitivity 25nm *Detection sensitivity differs depending on defect types and inspection methods. |
| Inspection time | 105 minutes/100mm² (Normal Scan) 60 minutes/100mm²(Fast Scan) |
| Mask size | 6025 |
- Basic Information
Terms related to this series
Please feel free to contact us by sending us a request from below or by calling us at the phone number on the right.
Photomask inspection system for semiconductor devices of 65nm node and further
