Wafer Edge Inspection System

EZ300

EZ300

For wafer edge yield management and process error analysis

Topics

Features

  • Defect inspection using high contrast images from confocal optics
  • Automatic defect classification including pit/bump analysis by proprietary algorithm
  • High-resolution 3D measurement that facilitates defect type identification and estimation

Applications

  • Quantitative management of wafer edges for in-line QC and early warning of process errors
  • Follow-on analysis of chip defects at wafer edges using SPC
  • Root cause analysis of yield loss at wafer edges

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