Please feel free to contact us by sending us a request from below or by calling us at the phone number on the right.
MURA/Film Inspection SystemWASAVI Series MR300
High sensitivity inspection system for thickness/surface shape variation of wafer in its thinning process for BSI and of resist application and color filter/lens shape forming in image sensor manufacturing processes
- Basic Information
Features
- High resolution optics can detect minute surface shape variation that determines image sensor quality
- Accuractely acquires surface layer information because the influence of base layer is minimal
- In line 100% inspection is possible
Applications
- Inspection of thickness non-uniformity of resist film, color filter and various types of deposited film Inspection of micro lens shape variation
- Surface shape inspection at the backside thinning process of BSI CMOS image sensor
- Inspection of micro defects, particles, scratches and so on
Specifications
Applicable substrate size |
φ 200mm,300mm Wafers |
|---|---|
Resolution |
50μm/pixel |
Throughput |
70 WPH（300mm Wafer） |
- Basic Information
Terms related to this series
Please feel free to contact us by sending us a request from below or by calling us at the phone number on the right.
Photomask inspection system for semiconductor devices at 45nm node and beyond
