Please feel free to contact us by sending us a request from below or by calling us at the phone number on the right.
TSV Etching Depth and Profile Measurement System WASAVI Series TSV300S
Inspection system for depth, bottom surface shape and CD in TSV forming process
- Basic Information
Features
- Employment of an IR optics exclusively for depth inspection and a sharing interferometer
- Realization of enough measurement accuracy while maintaining nondestructive procedure.
- All procedures from load to unload are automatic
- Manual loading type is also included in lineup
Applications
- Depth inspection in the TSV electrode formation process using etching, shape inspection of Via bottom surface and measurement of opening size at the top/bottom surfaces
- Measurement of power device's trench
- Analysis of deep Via structure related to the technologies such as MEMS technology and metal fine processing
Specifications
Dimensions (mm) |
1,280 (W) x 2,420 (D) x 2,100 (H) |
|---|---|
Applicable substrate size |
300 mm wafer |
- Basic Information
Terms related to this series
Please feel free to contact us by sending us a request from below or by calling us at the phone number on the right.
High sensitivity inspection system for thickness/surface shape variation of wafer in its thinning process for BSI and of resist application and color filter/lens shape forming in image sensor manufacturing processes
High-speed warpage/Stress inspection for patterned wafers
