Wafer related
Patterned Wafer Warpage / Stress Inspection System
WASAVI Series SK300
| High-speed warpage/Stress inspection for patterned wafers |
 |
|
|
Applications
- Inspection of warpage and stress (film stress) of patterned wafer.
- Stress analysis at development stage of wafer process and at start-up of new production line.
- Process QC and root cause pursuance for unexpected accident in production line.
- Stress liner film.
- The most advanced processes such as High-k, Metal Gate and Porous Low-k.
- Processes that go through large thermal stress such as millisecond anneal.
Features
- Compatible with wafers of most advanced fine patterns such as 45 nm and further.
- Automatic inspection of films of different reflectivity and quality without optical adjustment.
- Realization of high inspection ability including high-speed inspection makes this system compatible with production line.
- Utilization of flexible and high-reliability optical unit that is not based on the light interference principle.
Specification
| System dimensions | 1280 mm(W)x 2420 mm(D)x 2100 mm(H) |
|---|
| Applicable substrate size | φ300 mm wafer |
|---|
| Inspection capability | 30 nm(vertical resolution) |
|---|
| Throughput | 20WPH(Standard Mode) |
|---|
