Wafer related
TSV Etching Depth Inspection System
WASAVI series TSV300
| High Accuracy Depth Inspection System for TSV Formation Process |
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Applications
- Depth inspection in TSV formation process by etching / laser
- Measurement of trench in power devices
- Analysis of deep via structure in MEMS technologies, fine metal processing and such
Features
- Integration of confocal optics specifically designed for depth inspection and a white light interferometer
- Non-destructive and quick measurement with high enough accuracy
- All automated operation from load to unload
- TSV300M, manual load type, is also in the lineup.
Specifications
| System dimensions | 1280 mm(W)x 2420 mm(D)x 2100 mm(H) |
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| Applicable substrate size | φ300 mm wafer (compatible also withφ200mm) |
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| Inspection functions | Depth measurement (Z direction), aperture size measurement (horizontal direction) |
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| Depth measurement accuracy | 0.1 μm |
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