| Main features of the confocal microscopes H1200 (Confocal Microscope), HD and OPTELICS® are; (1) observation and measurement can be easily performed in the ordinary atmosphere, (2) real time observation is available, and (3) measurement accuracy is sub-micron. There are following application examples taking advantage of the features mentioned above. |
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| 1. Defect measurement of SiC |
| Defects such as crystal defects (epitaxial defects, micro-pipes) on SiC wafer can be spotted. Confocal differential interferometry eliminates the
influence of substrate back surface and accordingly yields high contrast images, which enables even defect measurement. In-plane dispersion of step bunching at wafer surface can also be observed and measured.
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| 2. Quality control of PV cell |
| Confocal microscope is used for 3D image observation of texture structure of anti-reflective film, surface roughness measurement, profile measurement of surface electrode (finger line) and evaluation of edge condition of PV cells. It is also effective for shape measurement of laser scribing and for measurement of film thickness dispersion in thin film type PV cells.
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| 3. Measurement of MEMS |
| For quality preservation in micro processing technology, a confocal microscope with a capability to automatically perform measurement by special
software is best suited. After speedily performing measurements on patterns,line widths and height, the result is output in a format generated by user,once a user sets a sample and starts the microscope operation. This type of function is only possible because of the very fast scan speed that Lasertec can realize.
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| 4. Evaluation of Lithium Ion Battery |
| Cathode material for lithium ion battery is in the form of lithium cobalt oxide on aluminum. Needs to observe (in moving pictures) charge/discharge reaction at the lithium cobalt oxide surface in solution is expected to be high.
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| 5. Evaluation of nanoimprint |
Nanoimprint recently in the spotlight is a nano-scale-fabrication technology based on thermal transfer of nanometer order patterns by pinching resin between a mold and a substrate.
Process accuracy at each step of nanoimprint, steps such as resin application, press, thermal transfer and mold releasing, can be confirmed.
Nanometer measurement over a wide area is available by using an optional two-beam interference measurement method.
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