New Product: PC Parts Warpage/3D Profile Inspection System [PSK380]
Lasertec has commercialized a PC Parts Warpage/3D Profile Inspection System [PSK380] that inspects Warpage/3D Profile of Parts for Personal Computer (PC) with high speed, and starts to accept orders in November.
Lasertec has commercialized an Inspection system "PSK380" that performs non-contact measurement of warpage and height of parts and Printed Circuit Board (PCB) for PC and mobile phones.
Parts and PCB are rapidly transformed to be smaller and thinner in response to the advancement of electronic apparatuses such as PC and mobile phone in the direction of ever higher performance and lighter weight. Also, in the field of electronic parts mount, the progress of the surface mount technology pushes hard to make mount density higher and requirement for leveling-up and higher reliability of manufacturing processes is becoming more demanding, resultantly.
Especially in the field of high density printed wiring, parts and PCB are required to be thinner, which results in larger warpage of parts and PCB. Such larger warpage of parts and PCB becomes a new cause for product deficiency occurrence and now the warpage management is one of the most important themes in quality management.
The "PSK380" newly developed by Lasertec is an inspection system capable of measuring such kind of warpage mentioned above with an inspection speed more than 10 times higher than that of the conventional 3D measurement system, based on its unique optics and the high-speed/ high-precision stage technologies. The minimum measurement point is as low as 0.125 mm spacing and the size of measurement area is as large as 380 mm x 400 mm.
The "PSK380" presents very stable warpage inspection function all through the phases from the development phase to the mass production phase for PC parts and PCB.
In the development phase, this system can be used for acquiring height/lift data all at once by just one measurement of mounted electronic devices in addition to warpage data of specified PCB area while conducting automatic path/fail verification for each aforementioned item.
In the mass production phase, high-speed 100% inspection prevents accidental troubles, which contributes to quality control and process management.
- Inspect samples more than 10 times faster than the conventional 3D measurement methods
- Acquire warpage/height/lift data all at once by just one measurement
- Verify pass/fail for each item described above
- Warpage and height inspection of parts on assembled PCB
- Warpage inspection of PCB and assembled PCB for PC