As a sister model of the industrial standard Mask Substrates/Blanks Inspection System M1320, which is typically called "MAGICS", Lasertec introduces a new product "EUVL Mask Substrates/Blanks Inspection System M1350" that supports the EUVL technology employed in semiconductor devices with a 0.07?m or finer design rule, and will start to accept orders on June 1.
* "MAGICS" is an abbreviation for Multiple image Acquisition for Giga-bit Inspection with Confocal System.
* Mask substrates are glass substrates before mask blanks are made.
* Mask blanks are substrates before patterning for Photomask production.
* EUVL is an abbreviation for Extreme Ultra Violet Lithography.
Comments
As a key technology for development of the semiconductor business in future, the Extreme Ultra Violet Lithography (EUVL) with an exposure wavelength of 13 nm has been studied at many R&D laboratories around the world. Besides its short wavelength, EUVL employs reflection type masks instead of conventional transmission type masks. As a result, it is confirmed that product's quality judgment depends on those defects and particles of an ultra small size that conventional inspection systems fail to detect. Lasertec's new model M1350 has achieved a breakthrough, by providing defects detecting sensitivity with novel features enough for EUVL mask substrates/blanks inspection, through application of confocal optical system to a multi-beam laser. Thus, M1350 is a total inspection system suitable for a wide variety of inspection.
Featuring high sensitivity, high resolution, high contrast, flare (image blur) free optical characteristics, and high resolution even in the z-axis direction, the confocal optical system has been utilized as the key technology for Lasertec's inspection systems. In the model M1350, use of a multi-beam laser light source in confocal optical system allows to realize high sensitivity and high throughput at the same time, which no conventional inspection system has achieved.
Characteristics
- High sensitivity, high resolution, high contrast, and flare free
- Ability of inspection and reviewing in a single unit
- Less influence from haze and color shading, and inspection of all types of substrates in the mask blanks production process with a high sensitivity
- 3D review function utilizing the confocal/differential interference method that shows a high resolution in the z-axis
- Acquisition of accurate coordinate data through a high accuracy stage with an air bearing and linear motor
- Intelligent ADC (Automatic Defect Classification) function using 3D information
- Dust free marking function
- High throughput
- Easy Windows-based operation
Purposes
- Inspection of glass substrates
- Inspection of substrates after multi layering
- Inspection of substrates after buffer layering
- Inspection of substrates after absorber layering
- Inspection of substrates after resist coating
