Pellicle/Photomask Particle Inspection System "PEGSIS P100"

Photomask is always required to maintain its high quality due to the fact that photomask is the original plate of circuit patterns for semiconductor devices. In concert with the shrinkage of semiconductor device patterns, the demand for higher quality of photomask is becoming stronger and stronger, and similarly the demand for higher defect inspection ability of inspection tools that gives confirmation and assurance of photomask quality is stronger and stronger. However, regarding the photomask inspection at wafer fabs, it is a fact that photomask is inspected by either naked eyes or by particle inspection tools that are installed in steppers with only 15um to 30um sensitivity. Inspection by naked eyes often misses defects and not really stable and particle inspection tools installed in steppers cannot correctly measure the size of the inspected particle and does not have mechanisms to observe inspected particles. For these shortcomings of the existing particle inspection, it is really difficult to examine the photomask whether it is good or bad.

Lasertec, in the aim to respond to the strong demand for high quality photomasks, has commercialized an inspection system [PEGSIS P100] with improved capability and functions in order to mitigate productivity slowdown of semiconductor devices, which originates to re-cleaning of photomask and such.

• A Particle Inspection System with achievement of highest inspection speed in the industry with very high sensitivity, which is compatible with photomasks for semiconductor devices with 90nm design rule and further.
• A Particle Inspection System best suited for outgoing test of photomasks, incoming test of photomasks at wafer fabs and quality assurance of photomasks right before usage, with its highest performance and functions.
• Detects particles with high sensitivity (4um) by sensing scattered light from particles with a CMOS sensor while using a light source laser of 532nm wavelength.
• Peripheral area of patterns can be inspected. (under development : Option)
• Because the detected particles can be observed under bright view or dark view and image data of particles can be stored, the system is effective not only for confirming whether is good or bad but also for quality management and analysis.
• Because the size of particles can be accurately measured by a CCD camera, very reliable determination of the photomask whether is good or bad is possible.
• All automatic inspection, automatic defect review and automatic defect size measurement functions are available as standard functions and high operability is realized.
• An autoloader for Reticle SMIF Pod (RSP) is available as standard equipment. Also, the system has flexibility as being compatible with stepper case and such. (Option)
• A clean unit (FFU) is available as standard equipment.
• A small footprint is realized by design aiming compactness. (W: 1375mm / D: 1600mm)
• A function to remove particles can be installed (under development: Option) and particle adhered to pellicle surface or glass surface can be easily removed. Because particles that have possibility to transfer image can be removed without pulling out photomask from the inspection system, the productivity slowdown caused by re-placing or re-cleaning of pellicles is prevented.

• Outgoing inspection after pellicle placing in the photomask manufacturing process
• Incoming inspection and regular inspection on photomask at wafer fabs
• Photomask quality confirmation inspection right before photomask usage at wafer fabs

Main Body

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