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New Product 2006

Nov 22, 2006

Photomask Inspection Systems "MATRICS Series"

Lasertec has commercialized new products "Photomask Inspection System [MATRICS* Series]" that is compatible with photomasks for semiconductor devices of 65nm design rule and further. Lasertec starts to receive purchase orders for this new product series in December this year. The MATRICS* series product lineup consists of X651 solely designed for a Multi die mode, X652 solely designed for a sSingle die mode and X653 designed for both a Multi die mode and a Single die mode.

* MATRICS: Mask Transmission/Reflection Image Comparison System

Background

Lasertec, having been developing and selling Photomask inspection systems since 1976, has a long history and experience in this inspection system field. The MATRICS series that we announce this time has achieved a very high sensitivity by refurbishing the technical platform of our conventional systems and collecting up all the most advanced technologies of Lasertec. Photomask is always required to maintain the high quality because of its own nature being the original plate for circuit patterns of semiconductor devices. In addition, the resolution of photomask patterns are becoming higher and more complex following the tendency that the resolution of semiconductor device patterns are becoming higher and the application of Phase shift and OPC (Optical Proximity Correction) technology is becoming more and more popular. On the other hand, wafer fabs using the ArF lithography are facing emerging problems of haze and foreign particles that have growth potential on Photomask surface, and importance of regular mask inspection at fabs is now highly recognized. Under such circumstances, a system capable of inspecting photomasks possessing high resolution and complex patterns, with high sensitivity, high throughput and reasonable cost has been strongly longed for. The MATRICS series by Lasertec is exactly the ones that satisfy this longing in the industry.

Features

  • Compatible with the most advanced phase shift masks such as EPSM and APSM
  • Compatible with OPC (Optical Proximity Correction) masks such as Assist Bar, Serif, Hammer Head
  • Usage of a Hg/Xe lamp that possesses an emission line at 248nm makes running cost cheaper than laser light source requires, and enables simpler and easier maintenance.
  • Compatible with automatic transportation of masks with OHT and such (Option)
  • Possible to inspect photomasks after pellicle has been mounted.
  • Design pursuing compactness by installing power sources and controlling systems within the main body (W:1555mm x D:2555mm)

Applications

  • Outgoing inspection before Photomask shipment
  • Incoming inspection, regular inspection and haze inspection of Photomasks at Wafer fabs

Configuration

A chassis in which all detection, control and substrate transportation parts are integrated.

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