TSV Etching Depth Inspection System "WASAVI Series TSV300"

Lasertec has commercialized a new product, "WASAVI Series TSV300" that inspects etching depth in the formation processes of TSV used for 3D stacking of semiconductor devices.

Today, semiconductor device is required to realize higher circuit density, higher operation speed and lower consumption energy, and consequently in order to satisfy these targets, 3D stack devices in which circuits are stacked in vertical direction, are beginning to be put into practical application. TSV plays an important role in vertical connection of upper layer circuits and lower layer circuits in 3D stack devices. TSV is generally formed either by etching or laser and depth management during TSV formation is a very important task because control of TSV depth has a substantial influence on yield of 3D stack device products. TSV300, a new Lasertec product, measures etching depth with high accuracy and high speed, which has been difficult thus far. TSV300 is based on integration of confocal optics that is the core technology of Lasertec and white light interferometer. It has been difficult for conventional optics to measure TSV depths because of the problems that light intensity of reflected light from the bottom of the etched via is very weak and also that the intensity of stray light (harmful light unnecessary for measurement) is relatively strong. TSV300 is equipped with confocal optics specifically designed for depth measurement, which eliminates stray light from measurement optics and captures very weak light reflected at the bottom of via. By utilizing a white light interferometer on the weak reflected light described above, etching depth measurement with high accuracy is realized.

Because TSV300 measures the TSV depths by utilization of light, there is no need to make fracture surface, which is necessary for conventional methods, and the TSV depth inspection by TSV300 is non-destructive, accordingly. Operation of TSV300 is very simple and easy, completely different from other complicated methods, and full automatic inspection of aperture diameter and depth of via by etching can be performed. These advantageous features of TSV300 offer stable inspection to TSV processes from development stage to production stage.

• Integration of confocal optics specifically designed for depth inspection and a white light interferometer
• Non-destructive and speedy measurement with high enough accuracy
• All automated operation from load to unload
• TSV300M, manual load type, is also in the lineup

• Depth inspection in TSV formation process by etching / laser
• Measurement of trench in power devices
• Analysis of deep via structure in MEMS technologies, fine metal processing and such

Main body, Controller PC, Control box

Please review product page for any further information.