Product

Lasertec releases a New Mask Inspection System, the MATRICS X9ULTRA Series

2022.04.26

A mask inspection system designed for pellicle-less EUV mask inspection in the technology nodes of 3nm and beyond

Lasertec announced the release of the MATRICS X9ULTRA series, a mask inspection system designed to inspect the photomasks used in extreme ultraviolet (EUV) lithography while their pellicles are not attached.

Description

The MATRICS X810EX and X8ULTRA series, two of the mask inspection systems previously launched by Lasertec, are widely used in mask shops and wafer fabs worldwide and renowned for their high-performance inspection, low running costs, and reliability. The newly released X9ULTRA series builds on the performance of these predecessor models, offering improved performance in the detection of particles on pellicle-less EUV masks.

As demand for semiconductor devices continues to grow, led by 5G, HPC, and high-performance servers, EUV lithography is being adopted for use in the semiconductor production process. In 2018, Lasertec released the X8 ULTRA series to address the need for the detection of small particles on EUV masks. Since then, it has been widely used among customers for pellicle-less EUV mask inspection. The newly released X9 ULTRA series uses Lasertec's newly developed high-power 193nm laser light source and high NA objective lens to achieve higher detection performance than the predecessor models.

Lasertec will continue to improve the performance of EUV mask inspection systems and contribute to the progress of the semiconductor industry.

Key Features

  • A mask inspection system designed for pellicle-less EUV mask inspection in the technology nodes of 3nm and beyond
  • A high-power 193nm laser light source and high NA objective lens enabling improved particle detection performance

Applications

  • Quality assurance inspection of pellicle-less EUV photomasks at wafer fabs
  • Particle inspection for EUV photomasks at mask shops