Through Silicon Via (TSV)

Description

Means through-hole of silicon. This is used for electrical connection between stacked chips.

Related Product
BGM Series
BGM Series

Direct and speedy measurement of Si thickness, TSV depth and RST before and after TSV back grinding process

Product Search

Product list
Semiconductor-related
FPD-related
Microscopes
Related information
Glossary

A collection of technical words often used with Lasertec products and technologies
Exhibitions

Schedule of events where Lasertec will exibit products
  1. Home
  2. Products
  3. Glossary
  4. Through Silicon Via (TSV)