TSV Back Grinding Process Measurement System
BGM300
Direct and speedy measurement of Si thickness, TSV depth and RST before and after TSV back grinding process
Topics
Features
- TSV depth measurements based on a combination of Lasertec-proprietary interferometer and IR optics.
- Applicable to measurements in both pre- and post-back grinding processes.
- BGM300 provides an optimum solution for back grinding process.
Applications
- Silicon thickness and TSV depth measurement prior to the back-grinding of TSV wafers
- Remaining silicon thickness (RST) measurement after the back-grinding of TSV wafers
- Detection of abnormal adhesive thickness of bonded wafers.
- Silicon thickness measurement after the back-grinding/thinning of BSI wafers
Specifications
| Dimensions (mm) | 1,450mm(W) x 2,650mm(D) x 1,885mm(H) |
|---|---|
| Applicable wafer size | 300 mm wafer |
| Applicable wafer type | Bonded TSV or BSI wafers |
