SiC Wafer Inspection and Review System
SICA88
Featuring both surface and photoluminescence (PL) inspection capabilities in one body
Topics
Features
- Concurrent inspection of various surface defects and Epi layer BPD/SF
- High accuracy Automatic Defect Classification (ADC) by virtue of ultra-high resolution review images
- High throughput (10 WPH with 6 inch wafer)
Applications
- Incoming and outgoing inspection of bare SiC wafers and SiC Epi wafers
- Monitoring of SiC polishing and epitaxial growth processes
- Management of SiC device manufacturing processes
Specifications
| Applicable wafer size (inch) | φ4, φ6, φ8 | |
|---|---|---|
| Applicable wafer type | Bare SiC wafer and SiC Epi wafer | |
| Throughput | 10 wafers (φ6 inches) per hour | |
| Surface inspection | Optics | Confocal DIC optics |
| BPD/SF inspection | Optics | PL imaging optics |
| Excitation wavelength | 313nm, 365nm, etc. | |
| PL wavelength | NIR, NUV, VIS, etc. | |
