Via Depth Measurement System
VIANCA Series
NEW
Measuring the depth of small-diameter, high-aspect-ratio vias for 3D / 2.5D / Hybrid bonding packaging processes
Topics
Features
- Lasertec’s proprietary optics enabling the measurement of the depth of small-diameter, high-aspect-ratio TSVs
- Supporting next-generation TSV architectures
Applications
- Depth measurement after via etching
- Copper recess level control for hybrid bonding
- Height measurement after copper pillar revealing and during bump formation
