Mask Inspection System
MATRICS X712 Series
NEW
Mask inspection system built for design nodes at 90nm to 250nm+
Topics
Features
- Die-to-Database inspection, Die-to-Die inspection, and Single-Die inspection
- Support for a wide range of design nodes: 90nm to 250nm+
- Compact footprint and maintenance‑friendly design for stable, long‑term operation
Applications
- Defect inspection and quality assurance inspection during mask manufacturing processes
- Incoming mask inspection and periodic quality assurance inspection at wafer fabs
- 1Die‑to‑Database (DDB) inspection: A method of inspection that compares the mask pattern with its design data and treats any differences as defects.
- 2Die‑to‑Die (DD) inspection: A method of inspection that compares adjacent die patterns on the same mask and treats any differences between them as defects.
- 3Single‑Die (SD) inspection: A method of inspection that detects defects within a die without an external reference.
