Mask Inspection System
MATRICS X810EX Series
Semiconductor mask inspection system for 20nm to 7nm nodes
Features
- Semiconductor mask inspection system featuring high sensitivity and high throughput at low cost of ownership for 20nm to 7nm design nodes and beyond
- 213nm QCW laser light source (>400mW) delivers twice the light intensity of its predecessor enabling higher sensitivity
- Optimized defect detection system reduces the scan time to 38 minutes per 100mm x 100mm area
- CD uniformity measurement and map output concurrent with defect inspection
- Compatible with RSP150 and RSP200 for optical masks
- Fully automated inspection linked with overhead hoist transport (OHT)
- Compact design with stage and control unit integrated in a single body
Applications
- Incoming and periodic quality assurance inspection of optical masks at wafer fabs
- Outgoing inspection of optical masks at mask shops
Specifications
| Inspection mode | Multi-Die Mode, Single-Die Mode |
|---|---|
| Scan time | 38 minutes per 100mm x 100mm area |
| Mask type | Cr, MoSi, OMOG |
| Mask size | 6 inch |
