High Sensitivity Wafer Edge Inspection System

CIEL Series

CIEL Series

Highly accurate classification of wafer edge and bevel defects that are not detectable by existing tools



  • Identification of small defects that cannot be detected or classified by existing tools
  • A high-throughput mode adaptable to meet operational needs
  • 3D profiling capability


  • Wafer edge and bevel inspection for process monitoring and feedback in semiconductor device manufacturing processes
  • Identification of yield-critical defects
  • Process improvement based on 3D measurement

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