Multi-Wavelength Wafer Inspection System
LX Series
High-speed whole-wafer inspection with multi-wavelength illumination for film thickness, etching, and CD monitoring
Features
- High-speed whole-wafer imaging capability ideal for production process monitoring
- Uniquely designed multi-wavelength high-brightness and low-noise optical system delivering high sensitivity
- Flexible algorithm enabling various analysis capability for film thickness, etching, and CD monitor
- High-resolution or high-throughput model available to meet specific application needs
Applications
- Monitoring of resist thickness and CD variation and excursion detection during lithography process
- Monitoring of various film thickness variation and tool qualification during deposition process
- Monitoring of etch depth variation and excursion detection during etching process
